Purpose: This study statistically analyzed solder void characteristics and their thermal effects in automotive LEDs to better understand void behavior and contribute to establishing acceptance criteria and process control guidelines.
Methods: Solder coverage and void ratios wer...
Purpose: This study aims to analyze the impact of early childhood teachers' stress coping strategies on their resilience and organizational identification, thereby seeking practical measures to contribute to teachers' psychological well-being and the maintenance of organizationa...
Purpose: The purpose of this study is to develop a systematic Customer Satisfaction (CS) evaluation scale tailored to the system semiconductor package substrate industry. Specifically, it aims to identify key Business-to-Business (B2B) service quality factors and construct an ev...
